Samsung and AMD Join Forces for Revolutionary AI Memory Development

Samsung and AMD Join Forces for Revolutionary AI Memory Development



Samsung and AMD Collaboration on AI Memory Technologies




Samsung has partnered with Advanced Micro Devices (AMD) to enhance their joint efforts in next-generation AI memory and computing technologies. This collaboration was formalised through a memorandum of understanding (MoU) aimed at boosting memory chip supplies for artificial intelligence (AI) infrastructures, as confirmed by Samsung on March 18.

The signing ceremony occurred at Samsung’s chip manufacturing facility in Pyeongtaek, Korea. Distinguished attendees included Dr Lisa Su, AMD’s Chair and CEO, alongside Young Hyun Jun, Vice Chairman and CEO of Samsung Electronics.

The partnership centres on providing Samsung’s forthcoming high-bandwidth memory (HBM4) for the new Instinct MI455X AI accelerators developed by AMD, as well as optimised DDR5 memory for AMD’s sixth-generation EPYC processors.

Jun remarked that Samsung’s leadership in HBM4 technology and next-generation memory architectures positions the company to offer exceptional turnkey capabilities that will advance AMD’s developing AI strategies.

It is noteworthy that Samsung has been a key supplier of HBM to AMD. The company has previously supplied HBM3E chips for AMD’s MI350X and MI355X accelerators.

According to Samsung, these innovations will support future AI systems that integrate AMD Instinct GPUs, AMD EPYC CPUs, and rack-scale architectures like the AMD Helios platform.

Samsung’s HBM4 memory is crafted using a 6th-generation 10nm class DRAM process along with a 4nm logic base die, achieving speeds of up to 13 Gbps and a bandwidth of as much as 3.3 TB/s.

Samsung conveyed that the AMD Instinct MI455X GPU is projected to be the ideal solution for high-performance systems managing AI model training and inference, utilising the HBM4 memory standard. Furthermore, AMD stands to gain from diversifying its supply chain.

In addition, both companies are looking into potential foundry agreements, with Samsung potentially producing AMD’s future chips.

This announcement was made during GTC 2026, following Nvidia CEO Jensen Huang’s declaration of a foundry partnership with Samsung Korea during the same event, where he praised Samsung’s HBM4 chips for their AI capabilities.

These strategic partnerships reinforce Samsung’s stature as a frontrunner in the HBM sector.


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