iPhone 18 Series Expected to Feature C2 Modem

iPhone 18 is already generating anticipation despite its launch being over a year and a half away. The latest information indicates that Apple’s forthcoming series will incorporate the C2 modem, which is Apple’s bespoke cellular chip.

Insights from Analysts on the iPhone 18

As per a report from 9to5Mac, Jeff Pu from GF Securities has revealed in his recent communication to investors that he predicts the inclusion of the “C2” modem in both the iPhone 18 Pro and iPhone 18 Pro Max set to release in 2026.

Transition from Qualcomm to Apple’s Modem Technology

Apple introduced the C1 chip with the recently released iPhone 16e, marking a shift from previously relying on Qualcomm’s cellular modems for its iPhones. However, the iPhone 17 series, which is anticipated to launch later this year, will not feature the C1 chip. This decision stems from the C1’s inability to support ultra-fast mmWave 5G, a technology that offers exceptional speeds in places like stadiums, airports, and densely populated urban centres. Apple has acknowledged the limitations of the C1 chip, indicating that it is merely an initial step and that advancements are anticipated in future versions.

Continued Use of Qualcomm’s Modem for iPhone 17

As a result, the iPhone 17 series is expected to continue using Qualcomm’s modems. The existing agreement between Apple and Qualcomm is set to last until March 2027, providing Apple the opportunity to enhance its modem technology while still utilizing Qualcomm’s hardware in its high-end iPhone models.

Previous Predictions Regarding the C1 Modem

Notably, analyst Ming-Chi Kuo had previously indicated that the iPhone 17 Air would also employ the C1 modem.

Qualcomm’s Competitive Edge over Apple’s Chip

In earlier statements, Qualcomm CEO Cristiano Amon highlighted the significant advancements of Qualcomm’s newly released X85 modem, which outperforms Apple’s C1 chip, creating a substantial disparity in performance between high-end Android devices and Apple’s iPhones.